Backing plates play an important role in PVD industry and have been a popular parts for a lot of sputtering target set. As a professional China sputtering target manufacturer, Baoji Oukai Sputtering Target summarizes the reasons of bonding backing plate in a sputtering target.

One of the key parameters that determine the performance of sputtering targets is the integrity of the bond between the sputtering target and the backing plate.

The most effective metallic bonding is with indium and is the preferred Baoji Okai sputtering target bonding method. Baoji Okai uses only high purity indium for the majority of its bonding, to ensure the strongest bond between a sputtering target and a backing plate.

Baoji Oukai sputtering target mainly introduces sputtering target bonding by its definition and the select of backing target.