The most common types of physical vapor deposition (PVD) are magnetron sputtering and evaporation, which could be either thermal or electron beam (e-beam). China sputtering target manufacturer----Baoji Oukai tells you how to choose PVD methods.
Sputtering is a technique whereby a solid target material is bombarded with energetic particles to eject atoms from it and then deposit a thin film on the substrate. Sputtering target and evaporation materials (ST&EM) play a vital role in industries like electronics, energy, optics,etc..
The vacuum magnetron sputtering coating can effectively reduce the working pressure of the target chamber and the working voltage of the target, increase the sputtering and deposition rate, reduce the substrate temperature and reduce the damage of the plasma to the film layer.
The magnetic material sputtering targets of Baoji Oukai Sputtering Targets Technology Co.,Ltd. are widely used as the key elements for producing magnetic recording media.
Magnetron sputtering is a new way of physical vapor coating, evaporation coating methods compared to earlier points, its many advantages are obvious.
Magnetron sputtering principle: in sputtering target (cathode) with an orthogonal magnetic field and electric field and anode, sputtering target in high vacuum chamber filled with inert gases needed (usually Ar), the permanent magnet forms 250 to 350 Gauss magnetic field on the target surface, with high pressure electric field.
Magnetron sputtering is a physical vapor deposition coating technique used to deposit thin films of materials, such as metals, plastics and ceramics, onto other surfaces or substrates.