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high purity Cu sputtering target Copper target

  • Cu
  • <100μm
  • 99.995%~99.9999%
  • widely used in coating processing industries

Item: Coating material high purity Cu sputtering target  Copper target

Material:  Copper
Purity: 99.995%~99.9999%

Technics: Vacuum melting, Patented thermo-mechanical process    

Application: Widely used in coating processing industries

a: architectural glass, car using glass, graphic display field.

b: electronic and semiconductor field.

c: decoration and mould field.      

d: advanced packing application

Copper is reddish and takes on a bright metallic luster. It is malleable, ductile, and a good conductor of heat and electricity (second only to silver in electrical conductivity).
Melting point: 1084.6 °C Boiling point: 2562 °C

A sputtering target is a disc of a high purity material used as an atomic sputtering source for ion beam bombardment. 

Due to the high purity copper ultra high purity copper has many excellent properties, in particular, apply to dc diode sputtering, three pole sputtering, four splash, rf sputtering, to target sputtering, ion beam sputtering, magnetron sputtering, etc., can be plated reflective film, conductive film, semiconductor films, capacitor film, decorative film, protective film, integrated circuits, display, etc., relative to other target material, copper material price is lower, so the copper target material is under the premise that can satisfy the function of the film the first choice of target materials.


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