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What are sputtering target types

Views:3     Author:Site Editor     Publish Time: 2017-07-10      Origin:Site

What are sputtering target types

  With the rapid development of electronic information industry, the application of thin film science is becoming more and more extensive.Sputtering is one of the main techniques for producing thin film materials, and the source material of sputtering deposition film is the sputtering targe.The thin film of the sputtering targe sputtering deposition is high density and high adhesion.

  Since the 1990 s, the microelectronics industry new devices and new material development is rapid, electronic, magnetic, optical, optoelectronic and superconducting thin films have been widely used in high and new technology and industrial areas, increasing the scale of sputtering target market.

  According to the application, the application mainly includes the application of sputtering targe in the semiconductor field, the sputtering targe of recording medium, the target of the film, the optical target, the superconducting sputtering targe, etc.Zhang qingli of the Shanghai iron and steel institute has divided the classification of the sputtering target and its corresponding material types and application fields in more detail.In the semiconductor field, the target, the recording medium and the sputtering targe are the three biggest targets.

  The shape of the target is cuboid, cube, cylinder and irregular shape.Cuboids and cubes and cylindrical shape target is solid, sputtering process, the circular permanent magnet in the surface of target to establish circular magnetic field, the axial equidistant circular etching area is formed on the surface, its disadvantage is that the thickness of the thin film deposition uniformity is not easy to control, the sputtering targe utilization rate is low, only 20% ~ 30%.Application both at home and abroad in the rotating hollow circular tube magnetron sputtering target, its advantage is sputtering target can be rotating around a fixed strip magnet components, and 360 ° target surface can be evenly etching, utilization rate is as high as 80%.


 
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