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Titanium copper sputtering target

  • OUKAI
  • Ti 、Cu
  • 99.95%
Quantity:

Product Name:Titanium copper sputtering target

Purity:99.95%

Melting point:1907℃

Chemical Composition:Ti,Cu

Shape:Flat target, according to your request

Technics:Hot Isostatic Pressing(HIP),Patented Thermo-mechanical process

Application:

Electroplating, electrolysis, wet metallurgy,petroleum chemical industry,

Energy engineering, ocean engineering,Surface treatment, electrode manufacturing


 
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