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Ti: Al 33:67% Ti-Al sputtering target
Ti: Al 33:67% Ti-Al sputtering target
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Ti: Al 33:67% Ti-Al sputtering target

  • OUKAI
  • Ti、Al
  • <100μm
  • 99.5-99.99%
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Item:Ti: Al 33:67% Ti-Al sputtering target

Material:Ti、Al

Purity: 99.5-99.99%

Grain Size: <100μm

Application:

1:Bonding on copper backing plate

2:Powder,granule

3:Customized by drawing


 
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