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Product Item: Thin film materials Si Silicon sputtering target
Material: Si
Purity: 99.9%
Technics: Powder metallurgy, Vacuum Sintering/HIP
Application: Widely used in coating processing industries
a: architectural glass, car using glass, graphic display field.
b:electronic and semiconductor field.
c:decoration and mould field.
d:optics coating materials
Silicon is the second most common element on Earth and it is the seventh-most common element in the entire universe. It is the most common semi conductor and the most widely used in the electronic and technology sector. There are different silicon fabrication methods including the horizontal gradient freeze method, the horizontal Bridgeman method, the vertical Bridgeman method, the vertical gradient freeze and finally the Czochralski pulling method.
Product Item: Thin film materials Si Silicon sputtering target
Material: Si
Purity: 99.9%
Technics: Powder metallurgy, Vacuum Sintering/HIP
Application: Widely used in coating processing industries
a: architectural glass, car using glass, graphic display field.
b:electronic and semiconductor field.
c:decoration and mould field.
d:optics coating materials
Silicon is the second most common element on Earth and it is the seventh-most common element in the entire universe. It is the most common semi conductor and the most widely used in the electronic and technology sector. There are different silicon fabrication methods including the horizontal gradient freeze method, the horizontal Bridgeman method, the vertical Bridgeman method, the vertical gradient freeze and finally the Czochralski pulling method.
