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The purpose of target in vacuum plating

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The purpose of target in vacuum plating

  The target has many functions, and the market development space is large, it has good use in many fields.The new type of splash - plated equipment USES powerful magnets to accelerate the electrons into a spiral motion to accelerate the ionization of argon around the target, resulting in an increase in the collision probability between the target and the argon ion.

  Increase the splash rate.General metal deposition by dc sputtering, mostly without conductive ceramics material is used communication RF sputtering, the basic principle is used in the vacuum glow discharge (glow discharge) to argon (Ar) ion impact surface of target (target), plasma of cation is speeding toward as a negative electrode surface coating material, the impact will make material fly out of target and form a thin film deposited on the substrate.

  Generally speaking, there are several characteristics of thin film coating with a splash process: (1) metal, alloy or insulating material can be made into thin film materials.(2) under the appropriate setting conditions, multiple complex targets can be made of the same composite film.(3) by adding oxygen or other active gases in the atmosphere of discharge, the mixture or compound of the target and the gas molecules can be produced.(4) the input current and sputtering time of the target can be controlled, and it is easy to get high precision film thickness.(5) compared with other processes, it is beneficial for the production of large - scale thin films.(6) the sputter particles are not affected by gravity, and the target and the base plate position are freely arranged.


 
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