Views:11 Author:Site Editor Publish Time: 2017-11-01 Origin:Site
The most common types of physical vapor deposition (PVD) are magnetron sputtering and evaporation, which could be either thermal or electron beam (e-beam). China sputtering target manufacturer----Baoji Oukai tells you how to choose PVD methods.
Magnetron sputtering is a versatile way to create very dense films with good adhesion. Magnetron sputtering is a plasma-based coating method that generates a magnetically confined plasma near the surface of a target. Then, positively charged energetic ions from the plasma collide with the negatively charged target material and atoms from the target are ejected or “sputtered”, which then deposit on a substrate or wafer.
The following is the features of magnetron sputtering
Excellent precision of film thickness, and density of film coatings – achieve denser coatings than evaporation
Perfect for metallic or insulating coatings with specific optical or electrical properties
Can be configured with multiple magnetron sources
Resistive thermal evaporation is perhaps the simplest form of PVD. It normally uses a resistive heat source to evaporate a source material within a chamber. The evaporated material rises in the chamber via thermal energy, ultimately coating a substrate with a thin film. This process can be used for metals or nonmetals and is a good choice for electrical contacts.
The following is the features of Resistive thermal evaporation
Cost effective way to create thin films of metals or nonmetals with lower melting temperatures
Can be used for indium bump deposition used in wafer bonding
Higher deposition rates than sputtering