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The common PVD methods : magnetron sputtering& evaporation

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The common PVD methods : magnetron sputtering& evaporation

      The most common types of physical vapor deposition (PVD) are magnetron sputtering and evaporation, which could be either thermal or electron beam (e-beam). China sputtering target manufacturer----Baoji Oukai tells you how to choose PVD methods.

      Magnetron sputtering is a versatile way to create very dense films with good adhesion. Magnetron sputtering is a plasma-based coating method that generates a magnetically confined plasma near the surface of a target. Then, positively charged energetic ions from the plasma collide with the negatively charged target material and atoms from the target are ejected or “sputtered”, which then deposit on a substrate or wafer.

      The following is the features of magnetron sputtering 

  • Excellent precision of film thickness, and density of film coatings – achieve denser coatings than evaporation

  • Perfect for metallic or insulating coatings with specific optical or electrical properties

  • Can be configured with multiple magnetron sources

      Resistive thermal evaporation is perhaps the simplest form of PVD. It normally uses a resistive heat source to evaporate a source material within a chamber. The evaporated material rises in the chamber via thermal energy, ultimately coating a substrate with a thin film. This process can be used for metals or nonmetals and is a good choice for electrical contacts.

      The following is the features of Resistive thermal evaporation

  • Cost effective way to create thin films of metals or nonmetals with lower melting temperatures

  • Can be used for indium bump deposition used in wafer bonding

  • Higher deposition rates than sputtering


 
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