Views: 4 Author: Site Editor Publish Time: 2017-05-24 Origin: Site
According to chemical component, sputtering target is divided into:
Metal target (pure metal such as Aluminum, Titanium, Copper, Tantalum, etc.)
Alloy target(Nickel Chrome alloy, Nickel Cobalt alloy, etc.)
Ceramic compound target(Oxide, Silicide, etc)
Due to different application fields, there are certain differences in selecting and characteristics of metal materials for sputtering target.
Application fields | Metal material | characteristics |
Semiconductor chip | Ultra-high purity Aluminum, Titanium, Copper, Tantalum, etc | Highest technical requirement, ultra-high purity metal, high precision size, high integrations |
Flat panel display(FPD) | Ultra-high purity Aluminum, Copper, molybdenum, etc | High technical requirement, high purity material, large material area, high uniformity degree |
Solar cell | Ultra-high purity Aluminum, Copper, molybdenum, etc | High technical requirement, wide application scope |
Tool modification | Pure metal chrome, chrome aluminum alloy, etc | Long service life, high property requirement |
Other fields | Pure metal chrome, titanium, nickel, etc | Mainly used in decoration and energy-saving,etc. |
