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The classification and application of high purity sputtering target

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The classification and application of high purity sputtering target

According to chemical component, sputtering target is divided into:

Metal target (pure metal such as Aluminum, Titanium, Copper, Tantalum, etc.)

Alloy target(Nickel Chrome alloy, Nickel Cobalt alloy, etc.)

Ceramic compound  target(Oxide, Silicide, etc)

Due to different application fields, there are certain differences in selecting and characteristics of metal materials for sputtering target.

Application   fields

Metal   material

characteristics

Semiconductor   chip

Ultra-high   purity Aluminum, Titanium, Copper, Tantalum, etc

Highest   technical requirement, ultra-high purity metal, high precision size, high   integrations

Flat panel display(FPD)

Ultra-high   purity Aluminum, Copper, molybdenum,   etc

High   technical requirement, high purity material, large material area, high   uniformity degree

Solar cell

Ultra-high   purity Aluminum, Copper, molybdenum, etc

High   technical requirement, wide application scope

Tool   modification

Pure   metal chrome, chrome aluminum alloy, etc

Long   service life, high property requirement

Other fields

Pure   metal chrome, titanium, nickel, etc

Mainly   used in decoration and energy-saving,etc.


 
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