The characteristics of sputtering target

　　 Materials for sputtering targets have to fulfill specific requirements: The most important characteristics include:

　　• purity

　　• chemical homogeneity in case of alloys (stoichiometry)

　　• homogeneity of the structure (grain size, texture, precipitates, crystallinity)

　　• target density

　　• no oxide or other impurity inclusions (metals and alloys)

　　• no pores and voids

　　Coating Materials 

　　• good electrical conductivity (ceramics and semiconductors)

　　• no surface contamination

　　• dimension, target surface roughness

　　• mechanical stability of the compound target