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Ta Tantalum sputtering target for vacuum coating

  • BAOJI OUKAI
  • tantalum
  • <100μm
  • 99.99%
  • Widely used in coating processing industries
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Name:  Ta Tantalum sputtering target for vacuum coating

Material: Ta

Purity: 99.99%

Grain size: <100μm

Techinics: Hot Isostatic Pressing (HIP), Powder Metallurgy, Patented thermo-mechanical process

Application: Widely used in coating processing industries

A: Magnetic Data Storage Application

B: Electronic and Semiconductor Application.

C: Decoration and Coating Application. etc.

Tantalum ingots, used in the production of tantalum sputtering targets, are electron beam (EB) melted, and have inherently high purity due to a combination of high vacuum settings, slow melting rates, multiple furnace passes, and careful control of all aspects of the process.

Tantalum sputtering targets make thin coatings via a sputtering process for copper interconnect metallization, magnetic recording media, printer components, flat panel displays, optical and industrial glass, and thin film resistors.

 
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