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Name: Ta Tantalum sputtering target for vacuum coating
Material: Ta
Purity: 99.99%
Grain size: ＜100μm
Techinics: Hot Isostatic Pressing (HIP), Powder Metallurgy, Patented thermo-mechanical process
Application: Widely used in coating processing industries
A: Magnetic Data Storage Application
B: Electronic and Semiconductor Application.
C: Decoration and Coating Application. etc.
Tantalum ingots, used in the production of tantalum sputtering targets, are electron beam (EB) melted, and have inherently high purity due to a combination of high vacuum settings, slow melting rates, multiple furnace passes, and careful control of all aspects of the process.
Tantalum sputtering targets make thin coatings via a sputtering process for copper interconnect metallization, magnetic recording media, printer components, flat panel displays, optical and industrial glass, and thin film resistors.
Name: Ta Tantalum sputtering target for vacuum coating
Material: Ta
Purity: 99.99%
Grain size: ＜100μm
Techinics: Hot Isostatic Pressing (HIP), Powder Metallurgy, Patented thermo-mechanical process
Application: Widely used in coating processing industries
A: Magnetic Data Storage Application
B: Electronic and Semiconductor Application.
C: Decoration and Coating Application. etc.
Tantalum ingots, used in the production of tantalum sputtering targets, are electron beam (EB) melted, and have inherently high purity due to a combination of high vacuum settings, slow melting rates, multiple furnace passes, and careful control of all aspects of the process.
Tantalum sputtering targets make thin coatings via a sputtering process for copper interconnect metallization, magnetic recording media, printer components, flat panel displays, optical and industrial glass, and thin film resistors.
