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Sputtering target manufacturer supply planar copper nickel alloy target

  • BAOJI OUKAI
  • Cu Ni
  • <100μm
  • Widely used in coating processing industries
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Item: Sputtering target manufacturer supply planar copper nickel alloy target

Material: Cu Ni

Grain size: <100μm

Density: 8.85g/cm3

Melting point: 1350℃

Technics: Vacuum sintering furnace, hot isostatic pressing, thermal mechanical treatment and precision mechanical processing

Application: Copper nickel alloy target is of silver white metallic luster, It is manufactured through vacuum sintering furnace, hot isostatic pressing, thermal mechanical treatment and precision mechanical processing. Now, it is widely used for PE, STN, Ai, TFT, TP, LCD, vehicle navigation, glass, semiconductor and other magnetron sputtering coating.

Copper-Nickel alloy target, belongs to sputtering targets. Weight ratio is various, such as 75:25,80:20,98:2 and so on.There are two kinds of shape,circular and square. Circular target's area is below 300mm,thickness is above 0.3mm. Square target's area is 300X300mm,thickness is above 0.3mm.


High purity alloys target has been widely applied in the decoration profession, aerospace, anti-corrosion layer, antifriction tool membrane, integrated circuit, display, solar battery, optical components, magnetic storage, etc.

 
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