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Pure W1 polished surface Tungsten sputtering target with factory price

  • BAOJI OUKAI
  • Tungsten
  • <100μm
  • 99.95%
  • Semiconductor, PVD, CVD.
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Item:  Pure W1 polished surface Tungsten sputtering target with factory price

Material: Tungsten 

Purity: 99.95%

Grain size: <100μm 

Technics: Powder metallurgy

Application: Semiconductor, PVD, CVD.


The tungsten target is made from raw ground tungsten powder, which has been pressed into form and sintered. It is then hot isostatic pressed, bloomed, cold rolled, machined and bonded with a copper backing plate. 


Tungsten target implies an X-Ray tube where high energy electrons are directed in a vacuum to strike a tungsten target.Where the electrons strike the tungsten very short wavelength X-rays are generated and pass out through the vacuum tube for use in medical diagnosis and engineering radiography of welds and castings etc.Tungsten has a very high melting point but it is nevertheless melted where the beam strikes:for this reason the target is rotated to give a fresh target surface very frequently and the tungsten target is a fairly thin plate welded or brazed onto a water-cooled copper backing.Less than 1% of the electrical energy delivered into the X=ray tube comes out as X-rays;the other 99+% is waste heat.Tungsten is chosen for the short wavelength and penetrating power of it's characteristic X-rays rather than because of it's high melting temperature.

 
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