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Properties requirements of sputtering targets

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Properties requirements of sputtering targets

  Magnetron sputtering deposition is a new kind of physical vapor phase deposition method, which use the electron emission electron gun system and focus on the plating material to make the atoms that were sputtered on the target follow the principle of momentum transfer move from the target surface to substrate deposition film with higher kinetic energy. The plated material is called sputtering target.

  Sputtering targets are mainly used in electronic and information industries, such as integrated circuits, information storage, liquid-crystal display, laser storage and electronic control devices and so on. It is also used in glass coating, wear-resisting material, high temperature corrosion resistance and high-grade decorative goods. The sputtering target material is also the essential key material necessary for manufacturing the chips and has many advantages ,such as uniformity and controllability of metal coating.


  The purity is one of the main property indexes for sputtering target material, because the purity of the target material has great influence on the property of the film. However, the requirements for the purity of the target material are not the same in practical use. For example, with the rapid development of microelectronics industry, the silicon wafer size ranges from“6”,“8” to 12, but the wiring width ranges from 0.5 um to 0.25 um, 0.18 um and 0.13 um, 99.995% of the target material can satisfy the 0.35 umIC technological requirements before, and the preparation of 0.18 um lines for the purity of target requires 99.999%, even 99.999%.

  Impurity Content

  The Impurities in the solid of the target and the oxygen and water vapor in pores are the main pollution sources of deposition. Different target materials have different requirements for different impurities. For example, the pure aluminum and aluminum alloy targets used in the semiconductor industry have specific requirements on alkali metal content and radioactive element content.


  In order to reduce the stomata in the solid of the target material and improve the performance of the sputter film, the target material is usually required to have higher density. The density of the target material affects not only the sputtering rate, but also the electrical and optical properties of the film. The higher the target material density, the better the film performance. In addition, to improve the density and strength of the target material ,it can better support the thermal stress during the sputtering process. The purity is also one of the key property indexes of the target material.

  Grain size and grain size distribution

  Usually the target material is polycrystalline structure, and the grain size can be ranged from micrometer to millimeter. For the same target material, the sputtering rate of the small target is faster than that of the target with coarse grain size. However, the thickness distribution of the thin films with smaller grain size is more homogeneous. Oukai has been working on the development and manufacturing high-end target materialsfor many years to win customers' trust and make high-end quality products.

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