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Metal sputtering target-----Ta tantalum sputtering target

  • Ta
  • <100μm
  • 99.99%
  • thin film material

Item: Metal sputtering target-----Ta tantalum sputtering target 

Material: Ta

Purity: 99.99%

Grain size: <100μm

Technics: Hot Isostatic Pressing, Powder metallurgy

Tantalum targets, also known as tantalum planar sputtering targets, provide consistent and reproducible process performance with high thickness uniformity. The elimination of texture banding during fabrication produces a uniform micro structure, which delivers improved early-life stability and consistent-through-life sputter performance.
For tantalum target, sputtering target supplier-----Baoji Oukai focus on to offer our customers with high purities ranging from 3N to 5N, fine and uniform grain size, elimination of strong texture banding, and early target life size stability.

Tantalum sputtering target is achieved by press working to obtain tantalum sheet, high chemical purity, grain size
is small,the recrystallized structure and the three axial consistency, mainly used in optical fiber, semiconductor wafers and integrated circuits splashshot deposition coating,tantalum target for cathode sputtering coating, high vacuum getter active materials, and is an important film technology material. 



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