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Item: High Purity Tungsten(W) Sputtering Target for Vacuum Coating
Material: Tungsten
Purity: 99.95%
Grain size: ＜100μm
Technics: Powder metallurgy
Application: Semiconductor, PVD, CVD.
Tungsten sputtering targets made in the form of plates are used to deposit thin barrier films during the metallization of semiconducting components of integrated circuits.
Our tungsten sputtering targets have a high purity, and the film formed using our sputtering targets has a high electrical conductivity, which reduces the generation of particles to the greatest degree during the manufacturing process. This purity is up to 99.95%, and provides customers with a high sputtering rate in order to increase productivity.
Item: High Purity Tungsten(W) Sputtering Target for Vacuum Coating
Material: Tungsten
Purity: 99.95%
Grain size: ＜100μm
Technics: Powder metallurgy
Application: Semiconductor, PVD, CVD.
Tungsten sputtering targets made in the form of plates are used to deposit thin barrier films during the metallization of semiconducting components of integrated circuits.
Our tungsten sputtering targets have a high purity, and the film formed using our sputtering targets has a high electrical conductivity, which reduces the generation of particles to the greatest degree during the manufacturing process. This purity is up to 99.95%, and provides customers with a high sputtering rate in order to increase productivity.
