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High Purity Tungsten(W) Sputtering Target for Vacuum Coating

  • BAOJI OUKAI
  • Tungsten
  • <100μm
  • 99.95%
  • Semiconductor, PVD, CVD.
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Item:  High Purity Tungsten(W) Sputtering Target for Vacuum Coating

Material: Tungsten 

Purity: 99.95%

Grain size: <100μm 

Technics: Powder metallurgy

Application: Semiconductor, PVD, CVD.


Tungsten sputtering targets made in the form of plates are used to deposit thin barrier films during the metallization of semiconducting components of integrated circuits.


Our tungsten sputtering targets have a high purity, and the film formed using our sputtering targets has a high electrical conductivity, which reduces the generation of particles to the greatest degree during the manufacturing process. This purity is up to 99.95%, and provides customers with a high sputtering rate in order to increase productivity.

 
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